Electronics Forum | Tue Nov 17 12:34:37 EST 1998 | Kurt Waskow
I am interseted in an entry level placement machine and looking for opinions and advice on manufacturers. My present line, an MPI-580 just became obsolete due to a bankruptcy situation! I need to place BGA and 20 mil fine pitch, speed is not too cr
Electronics Forum | Thu Jun 25 13:00:41 EDT 1998 | Bill D.
I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor thr
Electronics Forum | Fri Jun 26 09:35:46 EDT 1998 | David S.
| I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor t
Electronics Forum | Tue Jun 30 12:06:04 EDT 1998 | Michael Fogel
| | I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor
Electronics Forum | Wed May 13 14:22:17 EDT 1998 | JoSi
Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, thus improve
Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond
I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether
Electronics Forum | Thu Jan 22 12:21:54 EST 1998 | Michael Allen
Is there a standard (JEDEC or other) for "lead sweep" errors on fine pitch (eg, 0.5mm) gull wing leads? Parts from one of my suppliers has a sweep error up to 6 mils; the mechanical drawing does not address lead sweep error, nor is there a true posi
Electronics Forum | Wed Aug 15 05:19:14 EDT 2001 | hardy boy
Hi, I have a fine pitch QFP (TQFP100) and after reflow soldering, i got less solder ( not enough fillet) on the toe area but have good fillet at the heel. Does this mean that I have a weak solder joint or is my process not too good ? What is importa
Electronics Forum | Wed Aug 29 14:22:49 EDT 2001 | kerryn
We clean 40 - 50 stencils per day. I am having a problem with dry solder paste in some of the fine-pitch apertures. Manual inspection of every aperture is not feasible. I have checked out the StencilScan inspection system advertised on the SMTNet.
Electronics Forum | Mon Oct 15 17:49:16 EDT 2001 | Leland W.
Something you'll want to consider is what happens with bits of tape that become relocated due to manual or automatic wiping. I've seen them block fine pitch apertures and create an insufficient solder condition that, guess what, wound up in the hand
