Electronics Forum | Tue Oct 13 16:26:26 EDT 1998 | Earl Moon
| | We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impac
Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc
SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no
Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas
We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One
Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp
Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c
Electronics Forum | Thu Mar 14 09:21:38 EST 2002 | davef
You should be looking for a better method of depaneling your boards. Listen. If you breaking components, it's not the component. It's you. Either you are: * Applying too much force. * Bending the board too much. * Locating the components too clos
Electronics Forum | Thu Oct 27 15:49:06 EDT 2011 | davef
MachineHead: I'm not so clear on the definition of the problem. Is it: * Some components are picked, but others are not picked and remain in the pocket of the tape * All components are picked, some are placed, but others are not placed * Everything p
Electronics Forum | Wed Jun 28 13:45:20 EDT 2000 | Paul Wright
A portion of our business is quick turn prototypes. The difficult part of doing this effectively is component descriptions. One customer will call a component SSOP-20, another will call his SSOP-20 but the lead pitch will be different, another wil
Electronics Forum | Fri Jun 04 18:18:28 EDT 2004 | gabriele
Hi Ricardo, You should complete the question with more details like : - kind of components pkgs (Chips, SO,TSOP,QFP,BGA,CSP,etc) and % of them versus the total (400) - tech complexity of components (0402 ? Finest Lead and ball Pitch ? SMT conne
Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w