Electronics Forum | Thu Jun 02 10:54:12 EDT 2011 | davef
Al: We agree with AVFOM. You have a different problem than solder paste mesh selection. Most often, tombstoning occurs when the wetting forces on the two pads are unequal. Examples of things that can cause this are: * Pads are different * Board pad
Electronics Forum | Wed May 14 18:22:07 EDT 2014 | hegemon
Dave is touching on one of those magical things that keeps us process engineers well paid and dancing (Well, some of us, lol). Heavy boards with light components. Solder Follows heat. Component heat up earlier. Repeat, Solder follows the heat. Care
Electronics Forum | Thu Apr 27 17:28:00 EDT 2017 | methos1979
At the time we purchased our MV-3L our smallest component was the 0805 so we got the 5 megapixel down camera although I don't remember the resolution but it was not the most fine one they had. We've since added 0604 components and solder evaluation i
Electronics Forum | Thu Jan 11 19:18:24 EST 2024 | madisreivik
Hello ! FUJI IP3 left head sometimes places component with rotation error. Vision processing SHOWS that component needs rotation Mechanical side is checked, looks fine. Also, changed servo, no effect. It happens randomly, maybe 1 part from 30. It
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Sat Apr 01 16:41:01 EDT 2023 | dilogic
Today I stumbled upon very odd issue - we have one GSM2 with FlehJet heads on both axes. New program was created and it stops on the first task for Head2 throwing out a message like this: "Component 0u1/0805 (reference id C4) can't be found wit
Electronics Forum | Tue Mar 13 02:18:07 EST 2001 | JT
Biggest problem with the IIF is placing components with varying thickness (i.e. multpile vendors). We have to adjust production programs at start of each run to prevent excess scrap. Line Sensor tolerances can be adjusted to accept a wider range of
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Fri Jun 21 12:49:58 EDT 2002 | surinder
Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH). Also,taking consideration that the board is well design for Wave.This board has been designed end of last year. We have latest model of Electrovert ma
