Electronics Forum: fine pitch components (Page 146 of 227)

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber

According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c

Re: Coplanarity Measurement Machine

Electronics Forum | Wed Dec 01 01:15:44 EST 1999 | Jeff Skeith

dave, you are right on. a blow torch isn't needed to light a fire. a small coplanar aluminum block works extremely well. my dept fixes thousands of fine pitch parts to to less than 4 mils from low lead to high lead every month. all we use is a sm

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F

snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do

Re: Stencil screen cleaners

Electronics Forum | Thu Jul 22 14:42:21 EDT 1999 | Bill Schreiber

Dear Jason, Smart Sonic has over 500 stencil cleaners in operation around the world. The Smart Sonic Stencil Cleaning Process is the only cleaning process that is Certified Environmentally Safe by the Environmental Protection Agency (EPA) and verifi

Re: Wave Soldering DPPM

Electronics Forum | Mon Jun 14 09:16:54 EDT 1999 | C.K.

| Dear All, | | We are having a big debate over what is the industry standard in DPPM on the wave sodlering process. is a DPPM of about 800 satisfactory. As per our big bosses it should not be more than 50 DPPM. Is the figure realistic. We are ty

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 07:28:03 EDT 1999 | Earl Moon

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien

| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Solder Paste Measuring

Electronics Forum | Wed Apr 07 08:38:33 EDT 1999 | Dave F

| | | I need help in finding solder paste measuring equipment. | | | | | Cuch: What aspect about paste are you trying to measure? | | | | 1 Paste qualification? | | 2 Incoming quality? | | 3 Print volume? | | | | Dave F | | | mostly looking for

Re: SPC on stencil printer

Electronics Forum | Tue Jan 12 17:56:18 EST 1999 | Jason Hall

| For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | It appears to me that there are two options: | A: to have a pn chart based upon


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