Electronics Forum | Fri Jun 18 19:41:24 EDT 1999 | KEVIN SIMPSON
| How are you inspecting pcbs post-reflow, are you inspecting all or sampling. The type of assembly involved would be mainly chip components with a mix of actives and a few 25mil and under pitch. | If you sample what are your fault rates looking lik
Electronics Forum | Tue Jan 05 15:36:53 EST 1999 | Earl Moon
A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20 mil pitch
Electronics Forum | Fri Dec 11 09:06:57 EST 1998 | Tom
| Has any body tried reflowing QFP's on both sides of a board. | GCollier Yes we do that quite often, we are using QFP132 with 0.5mm pitch in pure reflow process for both sides (no glue). It works well, the only problems we have seen was wiht compon
Electronics Forum | Wed Oct 03 09:56:51 EDT 2001 | Claude Tremblay
Hello everyone We have a QFP-308 (0.20" pitch)on a board and we have a lot of opens after reflow. We checked our profil by installing thermocouples on the pads of the component and everythings seems OK. We checked the coplanarity of the leads and it
Electronics Forum | Fri Apr 19 09:41:45 EDT 2002 | angiewest
We have been building BGA's for a couple of years. We even use a Universal Omni 4766 to place them with. Reflowing is where I thought we may have problems, Since we have an IR oven. But we bought a .010" thermocouple from Omega to measure the BGA
Electronics Forum | Wed Jul 17 10:59:26 EDT 2002 | fraser
Piece of cake, our sencil design software not only automaticaly mods the data for all component pitches but can apply anti solder ball designs ( homebase, form4 vnotch etc). As an added bonus it warns when the side wall to surface area ratio exceeds
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Wed Jun 02 18:28:17 EDT 2004 | russ
I would look at the Samsung CP40 or 45. They have the placement rates you want even a little better on the 40. the 45 will double that easily. They handle all types of parts down to 0201 components. Depending on the camera you select (25mm) you ca
Electronics Forum | Fri Jun 25 13:00:48 EDT 2004 | haviland
Hi--We deal in used and recond. equipment in the Midwest, and have available a 1999 Amistar #7100FV w/ a nice complement of feeders, (6) pick up heads, rated component placement at 18,000 pph. Does .0402's, .3 BGA w/ 20 mil pitch, Full vision system,
Electronics Forum | Thu Feb 10 09:09:30 EST 2005 | russ
99% (there will always be that one that gets jacked somehow). Your old placement equipmment may affect this by dropped parts that get underneath the BGA, etc.. hopefully the placement accuracy will at least get the parts halfway on pad and they will
