Electronics Forum: fine pitch components (Page 36 of 227)

Push&Pull Test of Fine Pitch Components

Electronics Forum | Thu Sep 25 18:37:36 EDT 2003 | adlsmt

Grind the point on a pogo pin from an in-circuit test fixture flat and push on a leg of the component till it bends, mark the deflection, then add about 30% to the length that the pin pushed in (maybe more if your using no clean and the residue adds

solder paste solvent

Electronics Forum | Wed Jan 30 17:23:07 EST 2013 | dyoungquist

In response to hegemon... This is not a recommended practice but..... We have added a few drops of water soluble flux to our water soluble solder paste when the paste is on the stencil. This was after the paste had "dried" out a bit. We have had

SMT INSPECTION SYSTEM

Electronics Forum | Fri Mar 16 01:26:31 EDT 2007 | CHITRA K

Many thanks for your reply. We would like to clarify two things; 1. We have recently purchased a vision system with oblique viewing facility to rotate the camera with 40x magnification, which we find useful to inspect fine pitch components . 2. Wh

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ

I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t

Re: N2 vs. Air Reflow Soldering

Electronics Forum | Fri Dec 15 11:21:45 EST 2000 | ralph

In my experiance, I have seen no difference in profiles between nitrogen and air reflows. What I understand is that the Nitrogen blanket allows for a greater solderability to gold plated pads. I also found that when dealing with fine pitch componen

Yamaha Machine

Electronics Forum | Wed Sep 06 06:04:16 EDT 2000 | Dreamsniper

Hi Guys, I'd like to collect info regarding YAMAHA YV88 Mark2 and YV100 series. Are they of any good compare to Universal GSM1 or Panasert MPAV2 ? My new company's products have hips of fine pitch components (0.5mm) and we are planning to get new eq

Re: Solder Printing Stencil design

Electronics Forum | Mon Jan 26 08:58:05 EST 1998 | Mike McMonagle

| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |

Comparison of models: Philips CSM 84, 84V and 84 VZ

Electronics Forum | Sat Oct 29 21:24:30 EDT 2005 | Paul Standeven

The CSM84 family units are 3 headed pick & place machines with mechanical chuck centering technology. They use a beam pointer for fiducial correction. The CSM84V is the same as the CSM84 but has a downward looking fiducial camera onboard in lieu of

SMT INSPECTION SYSTEM

Electronics Forum | Wed Mar 14 01:51:55 EDT 2007 | CHITRA K

We would like to buy a good microscope for visual inspection of SMT PCBs especialy for highly populated PCBs assembled with fine pitch components including BGAs . Please advise a suitable type of equipment visula inspection for volume production. A

Misalignment Brainstorm - Fiducials On Board VS On Breakaway Tab

Electronics Forum | Wed Apr 29 17:51:44 EDT 2009 | smt_guy

One more thing: I have a Panelized PCB with 8 boards on the X directions. As I move to the next PCB towards the right my misalignment moves to the right by 0.02mm. By the time I reach the 8th PCB I'm Off by between 0.12mm to 0.14mm. My fine pitch


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