Electronics Forum: fine pitch .4mm (Page 1 of 152)

Trouble selective soldering fine pitch connectors

Electronics Forum | Tue Dec 11 12:29:57 EST 2012 | deanm

Thanks for the comments so far. The smallest nozzle I've tried is a 4mm, which is what Pillarhouse used on this board to provide a sample. I tried this but wasn't as good as the 6mm. I've soldered the same connectors on a different board using a 10mm

fine pitch printing

Electronics Forum | Wed May 17 14:02:06 EDT 2006 | russ

So, what is the pitch of the part and the pad size, also tell us the thickness of stencil. Russ

fine pitch printing

Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123

I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe

fine pitch QFP

Electronics Forum | Sat Jun 18 00:35:15 EDT 2005 | mskler

Thanks to all. I am working on your suggetions will get back as the problem solved

fine pitch printing

Electronics Forum | Thu May 18 12:00:42 EDT 2006 | jdengler

I think he edited his original post.

fine pitch printing

Electronics Forum | Thu May 18 11:16:16 EDT 2006 | russ

Go 5 or 6 mil thick with stencil, i am not familiar with that pitch but I would recoomnd a 5mil. Was the thickness in this post before and i missed it? Russ

fine pitch printing

Electronics Forum | Thu May 18 09:18:33 EDT 2006 | Chunks

Hi dwelch123, 8 mils seems a bit thick to me. I would normally go 6 or 5 mil for fine pitch such as this. One other area to check is the the snap off. Are you using the slow snap off or just lowering the board right after print? If so you should

fine pitch QFP

Electronics Forum | Thu Jun 16 09:13:46 EDT 2005 | russ

We use a 5 mil for 16mil pitch QFPs, Make sure that the stencil has been polished. Type 3 paste. We have used lead free no-clean, lead no-clean, and water soluble lead pastes for these packages. We set the printer for a slow stroke .7 in/min. wi

fine pitch QFP

Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef

16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre

fine pitch printing

Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas

Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r

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