Electronics Forum | Mon Oct 04 11:34:29 EDT 2010 | vetteboy86
I've done minimal research to this point and understand my issue with solder on the double sided boards is due to oxidation that occures on the unpopulated pads when the board makes its first trip through the reflow oven. We did run both sides in a
Electronics Forum | Wed Jan 21 16:55:22 EST 2004 | patrickbruneel
Hi, Are you testing bare boards or soldered boards. Are the test probes in contact with soldered pads or contacting the copper with the osp coating (not soldered). If you could clarify this it would be easier to give some hints for probable causes.