Electronics Forum | Thu Jun 02 04:41:27 EDT 2005 | PW
K, aim to prevent return of rejected components back into stores. Consider potential damage caused through handling post pick and the effect of your product quality in using these components in the future. The best place to address this problem is a
Electronics Forum | Fri Jun 03 16:40:48 EDT 2005 | Andrea
I have a customer who has put a restriction against pure tin finish components. We have gotten our BOMs compliant with all but 5 parts. Fairchild p/n FDD6512A, FQD12N20C, IRLM120A Bournes 3214G-1-501E Sprague 10TS-D10 I am looking for a standard pr
Electronics Forum | Thu Jun 09 08:59:46 EDT 2005 | nice90
when we run a pilot run it usually takes a lot of time because it needs to be properly adjusted so that on production time everything could be set up easily and run smoothly. on a no feeder situation, components for the next model should be already l
Electronics Forum | Wed Jul 13 19:47:06 EDT 2005 | Darby
This works for me with ENIG finish and a SAC305 NC paste Reduce all pads by -2mil on all sides ie 0.050" x 0.050" becomes 0.046" x 0.046" EXCEPT Anything smaller than 30mil; -1.5mil Anything smaller than 20mil; -1mil Anything smaller than 15mil;
Electronics Forum | Thu Jul 14 19:12:40 EDT 2005 | sync40
Hi. In the past years I had made dozens of PCBs but now I am trying to get a professional finishing on them. The main problem is oxidation of the copper traces. Basically I use the silkscreen method to make the pattern in both layers and then etch. L
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
Electronics Forum | Fri Sep 16 13:19:59 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
