Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Thu Jun 14 21:14:04 EDT 2001 | davef
There�s tons of stuff on-line. Do a net search on "immersion silver". Examples are: * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=571 * http://www.enthone-omi.com/articles/FinalFinishesT1.pdf * http://www.epa.gov/opptintr
Electronics Forum | Tue Jun 19 17:33:09 EDT 2001 | genny
We don't actually leave the residue on the board, even though the Kester spec sheet says it is ok not to clean - we do spot hand cleaning with Safety Wash. Kester also said that there shouldn't be any problem with mixing RA with no-clean, although w
Electronics Forum | Mon Jun 25 09:08:22 EDT 2001 | Dave G
What type of board finish ? I've seen this same defect with QFP's on some of our HASL boards. Best I can tell either the PCB's have poor solderability or uneven pad heights due to poor solder leveling at the PCB fab. Newer PCB's seem to yield bette
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan
Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
Electronics Forum | Tue Jan 04 15:38:19 EST 2000 | Pat Pepper
Hi everyone: Our company is trying out immersion white tin for fine pitch assembly with what I would call mixed results. Reflow solder looks very good, but wave solder looks somewhat grainy (this may not be a problem in actuality). We had dewettin
Electronics Forum | Fri Jan 14 08:05:23 EST 2000 | Pat Pepper
Hi Dave, Thank you for the response. In answer to your responses I'll use the original numbers of my questions. 1. We would like to turn around our boards fast, but sometimes due to the market conditions we wind up with inventory. After reading
Electronics Forum | Mon Dec 13 09:43:28 EST 1999 | Chris May
As Wolfang says about slightly bent legs, handling is of the essence. Are these devices decanted into another tray for your machine. It may be worthwhile doing a "movement" chart for these components. Do not explain why or when you are doing it beca
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