Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko
Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez
Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal
Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o
Electronics Forum | Sat May 20 16:12:21 EDT 2000 | Earl Moon
Kathy, I couldn't not get involved here. A question of particular interest not in the normal vein or type. Wow! Good to see from you again even on the SMTnet. I still appreciate the help you gave on the DEK Proflo issue about two years ago. I just
Electronics Forum | Tue May 02 12:17:22 EDT 2000 | C.K.
Donnie is correct. "NO-Clean" doesn't translate to "no-residue!"..... who's giving you hassle about this - your ICT guys??!! Residue remaining on your PCB substrate is a function of many different things - flux deposition, solder mask (glossy means
Electronics Forum | Tue Mar 21 20:33:09 EST 2000 | Dave F
Shane: We don�t dispense, but we have thought about it. Several points about peelable solder masks in a no-clean (low residue) process: � Beware of latex peelable solder mask with a low res process without extensive testing. The problem is usuall
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Tue Mar 06 09:18:33 EST 2001 | davef
Two things: 1 Go to IPC and buy "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process - Provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concern
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
