Electronics Forum | Thu Sep 06 11:56:24 EDT 2007 | gmoritz
> x/y position of that lead does > > not change as the head rotates." > Heh-heh. You'd think so, wouldn't you? > Have you observed this with a magnifying glass? Heh-heh yourself. I (think) I know better than to think that it would withstand tha
Electronics Forum | Mon Oct 01 11:57:34 EDT 2007 | kpm135
I've never worked with a MPM printer but I had something similar happen on a DEK printer. The problem was that screens were manually centered in the machine and the operators were not careful enough when setting it up so the settings were very close
Electronics Forum | Thu Sep 04 14:39:35 EDT 2008 | bschreiber
Jim, There are several articles on Misprint cleaning at http://www.smartsonic.com/article.html including the "Stencil and Misprint Cleaning Handbook" by the IPC. Real Chunks, We have replaced several pneumatic stencil cleaners over the years that we
Electronics Forum | Fri Nov 21 16:48:05 EST 2008 | kennyg
Anyone have an 'easy' solution for reducing PCBA handling damage. I'm fighting low level chipped, scuffed and broken-off SMT parts. The damage is spread out across different areas of the assemblies. The assemblies are double sided SMT with 0402's
Electronics Forum | Thu May 14 14:24:28 EDT 2009 | swag
We depanel most of our PCB's using a router. We design and build all of our own fixtures in-house. Our rigid boards have not been a problem and we seem to have mastered tooling designs that work well. However, we are also running thousands of pane
Electronics Forum | Thu Oct 01 07:09:53 EDT 2009 | g2garyg2
Good Morning Here are a few thoughts. When mfg large flex circuits you will need to fixture them to create a stable production environment. As such, the foot print fo the product grows. So you may require systems that can handle 20 inch width by 38 i
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Wed Jun 30 00:20:08 EDT 2010 | leadthree
Thanks for your reply. This production lot is already finished. We produced in 2 lots, first was no-clean (and was ok), 2nd lot was cleaned (aqua based), and I need to look into the cleaning further. Since it's all finished I can't get parts from se
Electronics Forum | Wed Jun 30 12:41:25 EDT 2010 | rgduval
In general, if the process has been consistent for a period of time, then one should look at any new variables in the process. Therefore...the supposition that there's a bad lot of components is a very good one. Did Yageo offer any possible explana
Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg
There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of
