Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman
| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und
Electronics Forum | Wed Jul 01 11:19:50 EDT 1998 | Earl Moon
| I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some
Electronics Forum | Thu Jun 04 14:47:56 EDT 1998 | Steve Gregory
Hi Tim! There are two belt feeders that I've worked with that I can comment on. You're right about vibe feeders, they're good for one thing as far as I'm concerned...they make okay boat anchors, not good, just okay....(GRIN) The two that I'v
Electronics Forum | Tue Jun 02 13:44:04 EDT 1998 | Rin Or
| | | | | Does anyone use the "Quick Frame" with their Dek printer? | | | The threads on the screws keep stripping, so we thought | | | maybe we'd send our frames to a machine shop for heftier | | | screws. Has anyone done this? Is there a better wa
Electronics Forum | Tue Apr 07 17:33:17 EDT 1998 | Eldon Sanders
I agree with Michael, scoring works great. We build both and medium size small boards, anywhere from 2 to 100 square inches. Thickness from .030 to .062 Panels contain anywhere from 2 to 16 boards. About half are odd shaped, with cutouts and not
Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol
Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
