Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika
Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a
Electronics Forum | Mon May 07 12:18:06 EDT 2007 | wavemasterlarry
Nuts to that! Here's the right way todo this. I generally take a bill of Material and go line by line and charge accordingly. If there is a smt cap I charge 2.3 times the amount I pay, unless it�s a bigger than a 1206, then I charge 3.1 If it�s
Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef
NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.
Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef
Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree
Electronics Forum | Tue Nov 20 19:08:15 EST 2007 | Peter
Hello, I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond breaking off during vibration test, our customer has specs in a 5min 2-part epoxy (made
Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit
Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway
Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong
Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on
Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator
They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o
Electronics Forum | Tue Sep 02 15:35:55 EDT 2008 | modernprecison
I have a Siemens S-27 and I'm having occasional issues with 0201 components in particular. I'm using the 12 segment head and 902 nozzles with them. I'm making sure the magnet is clean of debris and the feeder is sitting flat. Most of the time they
