Electronics Forum: flex cicruit reflow (Page 1 of 12)

Reflow of flex circuit

Electronics Forum | Wed Mar 04 07:08:55 EST 1998 | Pat Copeland

I am looking for information on reflow temps for a flex board. There is only one 6 pin IC but the board has a 3M double sided tape. Is it possible to reflow without damaging the tape. Any suggestions?

Re: Reflow of flex circuit

Electronics Forum | Thu Mar 05 16:25:27 EST 1998 | Brian Stumm @ ETS

I am looking for information on reflow temps for a flex board. There is only one 6 pin IC but the board has a 3M double sided tape. Is it possible to reflow without damaging the tape. Any suggestions? Do you have a profiler for your reflow oven?

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Dec 22 18:09:07 EST 2004 | kmorris

At a previous job I had been taught that when reflow soldering polyimide flex circuits, it was necessary to pre-bake them before reflow soldering to prevent delamination. Our procedures said that there must be a 1hr bake prior to reflow, and the flex

Paste-in-Hole reflow soldering

Electronics Forum | Wed Aug 09 04:20:19 EDT 2006 | Rob

If you kink the leads will you be able to insert it without flexing the board/moving any of the other components? Also these pin headers aren't always designed for this process so have you checked that it will take the elevated temperatures?

Paste-in-Hole reflow soldering

Electronics Forum | Wed Aug 09 10:31:10 EDT 2006 | PR

pin and paste works. don't use gel flex at screen printer. Good luck PR

Low-temp reflow with PET

Electronics Forum | Mon Mar 25 16:40:17 EDT 2013 | rrpowers

I have a customer that is wanting to use a low-temp solder paste such as SnBi for a lead free circuit, however they are specifying PET for the flex circuit. I have always used polyimide for SMT reflow due to the temperature limitations of polyester.

BGA reflow on bottomside

Electronics Forum | Wed Nov 21 08:45:33 EST 2007 | davef

Rob: You say, "We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend to run that side first." We agree

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj

Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C

effective liquor for cleaning the residues in reflow oven

Electronics Forum | Wed Jun 13 21:33:34 EDT 2001 | davef

Todays crazy idea?! (environmental safe) February 22, 2001 05:33 AM Mattias Andersson [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&&Message_ID=5343&_#Message5343] Turning things just a bit, our working theory is: burnt flux

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef

Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One

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