Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Fri Feb 18 13:15:10 EST 2005 | need help
we are having problem with the flipchip sticking to the tape and reel cover, jumping around the tape pockets, and double stacking at placement during production. Does anybody else have this problem? Does anybody have a solution.
Electronics Forum | Tue Feb 17 01:12:52 EST 1998 | J.H. Kim
In solder bumping in flipchip technology by splder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks
Electronics Forum | Tue Feb 17 01:15:26 EST 1998 | J.H Kim
| In solder bumping in flipchip technology by solder printing, | the precise control of solder volume and height is very difficult. | Therefore I'd like to know the solution of this problem. | Thanks
Electronics Forum | Fri Jan 10 08:52:31 EST 2003 | nifhail
We are typical SMT subcontracting house. Recently I received RFQ for brds with DCA or Flip Chip technology. In our factory we only have typical SMT machines i,e Printer-HSP chipshooter-GSM IC placer-reflow oven. What are additional machines and pro
Electronics Forum | Mon Feb 21 03:56:34 EST 2005 | abhirami
Agree with Davef. Smaller the chip, more the static charge. I used to see this even with normal chips. Get an ionizer blow. It should solve your problem. May be switch to antistatic tape if affordable.Regards. GV
Electronics Forum | Mon Feb 21 12:51:30 EST 2005 | need help
Thanks for your help. We try the de-ionizer fan, helps some what but did not eliminate the problem. Can you tell me which model are you guys using.
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis
QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in
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