Electronics Forum | Mon Oct 02 11:23:04 EDT 2006 | ccapezza
EFD, Inc. manufactures adhesive dispensing equipment and may be able to offer assistance with your application. Check out our product information at http://www.efd-inc.com. We manufacture dispensing equipment ranging from manual dispensers to XYZ b
Electronics Forum | Wed Oct 16 10:51:35 EDT 2019 | radialvalve
Hi Joe, sorry for the delay in responding to your request, hope it's not too late. There are several questions to be answered before we can guide you to the best solution to meet your Thermal Gel Dispensing Needs. I would like the opportunity to disc
Electronics Forum | Wed Dec 02 20:11:37 EST 2009 | prodivegsr
Hi Lou, we are using a fluid dispensing machine. our current requirement is around 50um. From the Datasheet,the thinner 73 has a higher evaporation rate of 1.0 comapring with thinner 521 at 0.6... does the higher evaporation rate eliminate the bu
Electronics Forum | Thu Apr 21 08:45:53 EDT 2005 | davef
Top 10 products relating to solder paste are: * Printer * Stencil * Stencil storage rack * Squeegee * Squeegee holder * Under stencil wipe * Under stencil cleaning fluid * Stencil cleaner * Dispenser * Paste stirrer * Used paste / empty paste contain
Electronics Forum | Mon Jun 19 08:49:40 EDT 2017 | westshoredesign
Just buy a separate machine to apply paste. You'll be able to run faster, (by doing more at the same time) and you can probably find an air-over-syringe system for less than $2000USD. At the end of the day, that's probably less than you'll spend in t
Electronics Forum | Fri Jan 03 00:22:02 EST 2003 | Steve
We have an Ekra E5 that uses what looks like standard auto valve stems to dispense the cleaning fluid. They leak.. Are they just standard schrader valves or are special to withstand the chemistry of stencil cleaner?
Electronics Forum | Thu Jun 09 20:48:07 EDT 2016 | deanm
I'm assuming these are two leaded axial components. GPD Global makes fluid dispensing and component prep equipment. Component leads can be formed (or bent) in order to provide some resistance in the hole during insertion. This should prevent the comp
Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas
To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I
Electronics Forum | Fri Sep 11 12:08:10 EDT 2015 | derrikf
I built one using an old Asymtek Automove. When all was said and done, it cost less than $400, including what was paid for the machine itself. It's a very basic setup, (air over syringe), but for our needs it does everything and more. With air to syr
Electronics Forum | Thu Jun 22 19:43:05 EDT 2006 | davef
We hope this meets your standards for acceptable responses. * http://www.uic.com/wcms/images2.nsf/(GraphicLib)/Time_Pressure_Dispensing.PDF/$File/Time_Pressure_Dispensing.PDF * On the Flow Rate Dynamics in Time-Pressure Dispensing Processes; X. B. C
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
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Phone: (970) 245-0408