Electronics Forum | Wed Aug 10 17:19:24 EDT 2005 | Steve Stach
The propensity for flux residues to cause shorts can be increased in humid environments where water molecules hydrate the surfaces. At high frequencies, electrons travel on the surface of conductors/insulators, increasing the likelihood of shorts in
Electronics Forum | Thu Jul 14 16:12:22 EDT 2005 | russ
Lloyd, could you get us a pic from the side? It looks to me as if the pads may be too small or far apart, but I can't tell. We normally use a 35 x 35 pad size on .07 centers when we have the luxury of designing them that is.
Electronics Forum | Mon Jul 25 06:12:53 EDT 2005 | lloyd
Folks thanks for all the info, I'm gonna check out our pad geometries and see how they compare with industry standards. Brian, could you elaborate a bit more on the stencil design you have mentioned. Do you mean that you have offset the stencil aper
Electronics Forum | Wed Aug 10 08:10:39 EDT 2005 | davef
Comments are: * Sounds like it's necessary to clean "heareous F381, F352 no clean solder paste" in your application. Consider a paste that may be better suited to your application. * If you're cleaning "low residue flux", consider using an organic ac
Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian
| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder
Electronics Forum | Fri Feb 04 09:23:21 EST 2000 | Casimir Budzinski
If No-Clean flux does not need to be cleaned, then why do I get readings of up to 27(ug NaCl/sq in) on boards that are not washed, up to 23.4(ug NaCl/sq in) on boards washed with DI water only and from 1.2 to 10.1(ug NaCl/sq in) on boards washed with
Electronics Forum | Thu Sep 06 09:49:26 EDT 2001 | ksfacinelli
This is a real problem. We have experimented with a number of off the shelf products as well as discussed the issue with a few solder manufacturers. As you are aware IPA or Flux off can make the product look worse. I would discuss with the custome
Electronics Forum | Thu Jul 07 18:16:36 EDT 2005 | russ
What size discrete components and have you evaluated your pad geometries? If pads are too far apart this will happen. The flux resudue is simply there because you didn't solder the component. It will stay on top of the solder bump. You can see this
Electronics Forum | Thu Sep 01 12:07:35 EDT 2016 | pavel_murtishev
Is there any field proven spray cleaning technique able to remove flux residues under OSRAM LEDs? Is it possible in principle? The problem is that OSRAM LEDs are low standoff ones and I absolutely have no idea how cleaning agent could get there. Mo
Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon
In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s
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