Electronics Forum | Wed Apr 24 21:34:01 EDT 2002 | davef
Search the fine SMTnet Archives. Guidelines * Control: Flux specific gravity, preheater temp, conveyer speed, solder temperature. * Two most important parameters are: solder temperature & dwell time * Contact time. The optimum contact (dwell) time
Electronics Forum | Mon May 20 10:32:19 EDT 2002 | Hussman69
I actually built a dual tank fluxer for my Econo-Pak once to handle the same thing. Not all that difficult if you're mechanically inclined. BUT, for your application I'd recommend just hand spraying the 1 to 4 boards a month with any flux they reco
Electronics Forum | Mon Oct 21 13:40:05 EDT 2002 | slthomas
Is it safe to use the 100M ohm value found in Table 2 of J-STD-004 as a minimum for SIR with respect to flux specification acceptability? It (J4) appears to imply that that value provides some level of acceptability, but it just doesn't come right o
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Mon Dec 30 01:52:13 EST 2002 | MA/NY DDave
Hi I see DaveF already gave some good stuff. You should read or at least review some of the texts he listed or some others in the same subject areas of SPC (Statistical Process Control) or DOE (Design of Experiments). I won't list the other publish
Electronics Forum | Thu Jan 16 05:42:18 EST 2003 | nifhail
I've a query. I have one new Customer whom insisted us to use RMA paste on their product. The problem is, on some of their products they use via hole as the test point in where all the PCB finished are ENTEK and as usual I have to print solder paste
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Wed Apr 30 14:35:35 EDT 2003 | clarkk
Hello all, We have received reports from two customers about electrical leakage on pcb assemblies that used Kester paste #HM531 (63/37) and washed with Kester 'Bio-kleen' saponifier and DI water. The leakage is such that when the boards receive power
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a