Electronics Forum | Tue Jul 20 16:55:21 EDT 2004 | vwhipple@sono-tek.com
Pin Holes can be caused by many things. Does the problem come and go?? If so, see if there is a correlation to lot numbers on the boards or vendor. This could indicate a supplier issue.. possibly with the mask. Look at your soldered assemblies und
Electronics Forum | Mon Jul 26 06:32:58 EDT 2004 | cyber_wolf
Grant, The only thing that you really gain from refrigeration is a couple more months� shelf life. Refrigeration also seems to slow down flux separation. I am not sure how your paste consumption is, but we use ours up way before the expiration date
Electronics Forum | Tue Sep 14 18:27:37 EDT 2004 | MikeF
I would need a little more information to be able to rule out some of the possible causes. Have you checked to see if the pins with the minimal solder have anything in common, do all have traces to them? or internal power or ground plane connections?
Electronics Forum | Tue Sep 28 17:56:02 EDT 2004 | Vee Sar
Adam, I would first check hole to lead sizes on the components that you are having hole fill issues with to see that the spacing is withing spec. Second, check for oxides on lead tips, and contaminated leads that cause poor wetting and insufficient
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Tue Nov 02 09:05:15 EST 2004 | russ
I have never experienced voids when using the flux only for application. Search the archives for void causes. As far as "more paste is better" I think that could be a true statement if we are talking about adapting to co-planarity type issues. My
Electronics Forum | Tue Nov 16 11:11:18 EST 2004 | iva
Hello Charlie, For Application of thermal conductive glue by dispensing, Luxeon recommends Amicon E3503 from Emerson and Cuming (www.emersoncuming.com) for its standard Luxeon Power Light Sources. For optimal thermal connection it is important that
Electronics Forum | Tue Dec 14 18:03:22 EST 2004 | Dreamsniper
Hi, Can you guide with the above? I read ROSE Test is a process control tool. What about Ion Chromatography, SIR and FT-IR. What Accpetance Criteria will I use for our assembly when using WS Flux? My WS Flus says it has 0% Halide so What can Ion Chr
Electronics Forum | Wed Jan 19 12:34:32 EST 2005 | Robin Daniel
I have an issue where our production team has ran the wrong reflow profile on a no lead product where Indium NC SMQ-230 no lead paste has been used. You can still see the grains of solder after reflow. What I am look for is if anyone has any recomm
