Electronics Forum: flux (Page 441 of 499)

IPA versus Stencil Cleaning Solution

Electronics Forum | Thu Jun 15 06:58:54 EDT 2017 | cyber_wolf

Hmmm.... When I clean my stencils after I run a job, it is to clean the paste off the stencil so it doesn't dry out in the apertures and on the stencil surface while it is being stored. Wiping the stencils during production is to clear the paste of

The necessity of N2 enviroment on lead free wave

Electronics Forum | Sat Jun 24 07:34:03 EDT 2017 | tch

We bought a new lead free wave from Electrovert about a year ago and opted to not have the nitrogen options installed on this machine. We could not justify the cost of the nitrogen used versus the benefits that we would see. One downfall is that you

Lead free selective solder

Electronics Forum | Sat Jun 24 07:23:06 EDT 2017 | tch

You will need to preheat the boards for a lead free selective solder process. A preheat module is critical for any wave or selective solder process, if you don't get the board preheated properly the solder is going to resist flowing to the top of the

Requirements for a room with SMT equipment

Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef

Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0

Vacuum Reflow Oven

Electronics Forum | Thu May 03 17:33:20 EDT 2018 | dleeper

Solder paste selection can have a huge impact on size and quantity of voids. Talk to a few suppliers and ask for their recommendation on low voiding formulas. Pick a few of your top candidates and then perform a DOE to see who has the best result. S

Void under QFN TI LMZ20502SILT

Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef

Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t

Issue with Batch cleaner Aqueous

Electronics Forum | Wed Sep 12 00:18:19 EDT 2018 | aqueous

Here's a link to an article regarding foam mitigation techniques. It my be helpful. There are many causes of foam. Water alone does not foam. Flux, solubilized in to the water can produce foam. Defluxing additives contain defaming agents which should

sOLDER PASTE NOT COMING OFF SQUEEGEE

Electronics Forum | Fri Oct 05 15:35:19 EDT 2018 | davef

Paste sticking to squeegee: * Squeegee is heavily magnetized * Some pastes stick more than ... * Plastic squeegees stick more than metal * Old metal squeegees stick more than new * Paste needs to be worked * Paste needs to be at room temperatur

Package rebake

Electronics Forum | Wed Oct 24 02:09:34 EDT 2018 | simondsr

Hi everyone, I am new to this SMT. I have just graduated my study, have zero experience in SMT industry as I studied Automotive before. Ok lets proceed to the main objetive, I have a question regarding package rebake. From what I have learned, the

QFN standoff, industry standard

Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef

There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height


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