Electronics Forum: flux lifting (Page 1 of 6)

SOT-223 Flux trapped under part and lifting off pads

Electronics Forum | Wed Sep 29 09:29:47 EDT 2010 | swag

Take a few parts from the reel and look close at the parts to make sure the bottom surface of the leads is below the bottom surface of the body.

SOT-223 Flux trapped under part and lifting off pads

Electronics Forum | Thu Sep 30 11:30:46 EDT 2010 | babe7362000

Take a few parts from the reel and look close at > the parts to make sure the bottom surface of the > leads is below the bottom surface of the body. Yes I did that and they are below the body. I found the problem I think. The solder mask is abo

SOT-223 Flux trapped under part and lifting off pads

Electronics Forum | Wed Sep 29 08:26:03 EDT 2010 | babe7362000

We are Currently running a Board and it seems that the SOT-223's on the bottom side have flux and water trapped under the part. Nothing has changed in our process and this is the only board that it is happening on. We are using Kester R562 water wa

Tombstone caused by flux residue

Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd

This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly

No-Clean Wave Solder Process Control

Electronics Forum | Sat May 31 09:49:55 EDT 2008 | gregoryyork

physically lift board of after fluxing to visually see what is covered, or using thermal fax paper to get to see coverage works well. PROPER low residue or no residue fluxes leave benign insulating residue behind not corrosive.

No-clean PCB: Wave soldered twice...

Electronics Forum | Thu Mar 29 08:41:29 EDT 2007 | george

Hello everybody, I had not noticed until yesterday this situation. Whenever the wave operator has a problem with a PCB (i.e. lifted parts, misprayed flux, etc.) they wave solder the PCB again "to fix it". The problem is that PCBs do not look pretty

underfilling of bga

Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo

Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

Bga pad remaning solder

Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry

Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

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