Electronics Forum: flying and probe and wafer and test (Page 1 of 1)

SPEA flying probe programming and tech support

Electronics Forum | Tue Jan 22 09:21:03 EST 2019 | kathylci

Yes, SPEA is what we need now. But also interested in Takaya tech support and other test fixtures.

Testing and probe contact for wafers with bump

Electronics Forum | Mon Jun 05 05:41:48 EDT 2000 | casi

I need to find info about testing and probe contact about wifers with bump on pads. Thanks a lot to everybody that helps me

Lead Free and ICT

Electronics Forum | Sat Jun 03 03:35:16 EDT 2006 | mika

Yes we do have a problem with this. We have by now investigate numerous lead/RoHS PCBA:s The RoHS boards are by far the most difficult one's to probe and test. Our people at the "test area" including Flying Probe and ICT they spend a lot of time to t

AOI, Quality and SPC

Electronics Forum | Thu Mar 06 03:46:35 EST 2003 | testing

Thanks for the reply Mike, I will look forward to see the end result of your investigation (e-mail people_1@fsmail.net). Regarding the test machines, I was trying to ask what are the suited/or recommended from your experience, set of test equipment

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy

Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th

Resistors and capacitors 01005 measurement of value

Electronics Forum | Wed Jan 30 02:56:22 EST 2019 | robl

I'm with Steve and flying probing. As long as you are testing the capacitance of the cap in the circuit and not of the cap itself you'll get a pretty good indication. Most are going to be 10nf and 100nf decoupling caps at that size so quite easy to

Micro Solder Balls and Vias bridging Issue

Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007

Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns

Programming for Pick & Place and AOI machines

Electronics Forum | Tue Aug 01 07:32:51 EDT 2017 | jlawson

Another commercial tool is Valor MSS Process Preparation from Mentor-Siemens (Valor), can handle Gerber, PnP, ODB++, Native CAD ASCII Files, BOM and CAD Merge, SMT Pn Programming, AOI exports , DFT Engineering - ICT/Flying Probe programming, Stencil


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