Electronics Forum: foil (Page 36 of 39)

solder dispencing vs printing

Electronics Forum | Thu Jun 21 22:04:18 EDT 2001 | davef

This is my attempt at beating the "Fuzzburg 7" translator used on the SMTnet Forum that mashes everything it sees. Below the next paragraph are three paragraphs,each with a common numering sequence, where each paragraph represents the columns of a t

IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Thu Sep 23 20:23:58 EDT 1999 | Dave F

Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by co

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Thu Sep 23 20:57:13 EDT 1999 | Dean

| Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

Re: uBGA

Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee

| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

Re: problem in micro-BGA assembly

Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff

| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes

A few more things

Electronics Forum | Sun Apr 25 04:34:09 EDT 1999 | Earl Moon

No this message isn't about my triumphant return. It's not even about that lady I wanted to run away with to Mehico (who were you again). It's about progress and some of you might be interested, or not. 1) For DEKheads, I submit we had two of Britai

Re: Solder paste stencil modification

Electronics Forum | Fri Jan 15 09:11:28 EST 1999 | Steve Gregory

| Due to an foul up on my part, a circuit board ECO snuck up on me and I have a solder paste stencil that doesn't quite match the board. Two pads are off by about half a pad each. | | Can the solder paste stencil be modified? If so, what is the tec

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 09:02:18 EST 1998 | Earl Moon

| | | Hi folks , | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our in


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