Electronics Forum: foil crack (Page 1 of 1)


Electronics Forum | Tue Jul 22 09:05:14 EDT 2003 | davef

Any-Layer Interstitial [Inner] Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve


Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.

Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?

cracks between electrical conductive adhesive and round the edge of the Chip-leds

Electronics Forum | Tue Aug 15 07:02:13 EDT 2000 | George Verboven

We are assembling SMD-Leds (Chip LED cl-220yg-c-ts)on flex foil with Electrical conductive glue (Matthey A1401). When we investigated these foils we found cracks between the conductive adhesive and round the edge of the Chip-leds. This cracks cause f

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon

| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U

Kester Paste from Mexico

Electronics Forum | Tue Nov 27 08:47:24 EST 2007 | ratsalad

The letter below was dated December 13, 2006 from Kester's Senior Market Development Engineer. I guess since then they have moved production back to Mexico. We no longer use EM907 as our primary Pb-free paste so I haven't seen any containers in a w

Re: T sub G

Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon

| Hello, | Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e

Re: PCB fab supplier supplier/evaluation

Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon

| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple


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