Electronics Forum | Wed Jul 03 10:34:35 EDT 2002 | davef
Suggestions are: * Convince yourself that your paste printing and paste control processes are in control. * Convince yourself you oven is in-control and capable. * Get one of those FREE software packages from the profiler companies [ie, KIC, ECD, etc
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Mon Jul 15 00:21:46 EDT 2002 | tjyard
Frustrated? Where do I start. Our company just lost a contract assembly job we have been providing to Altera Corp for five years. They sent it overseas to China. We had to lay everyone off at our assembly facility. Yeah, you better learn to spea
Electronics Forum | Thu Jul 18 09:55:05 EDT 2002 | gdstanton
Mike, When we measure solder inspection yield by dividing the number of defective joints on a CCA by the total number of joints on the PWB. A defective joint is classified only once. That is we don't count multiple defects on the same joint. Our
Electronics Forum | Thu Jul 18 15:20:17 EDT 2002 | dragonslayr
I suggest following the standards developed by IPC for DPMO (go to IPC. org for more info) Create your own benchmark, within your own environment, for the specific PCA, then do trend analysis, 6 sigma improvements, etc. For a rule of thumb benchmark
Electronics Forum | Thu Jul 18 11:31:03 EDT 2002 | Mark S.
>But since we are a low volume high mix operation I need to account for almost every part used. I'm in the same boat, and we do more changing of feeders than actual placements it seems. What I have done which has improved things a lot is in our MRP
Electronics Forum | Sat Aug 03 08:44:11 EDT 2002 | P. Kannan
We are having 3 MPM UP-2000 printer & 1 AP-25 printer with us. I would like to have the technical guidance for my following application. For one of our model, there is a requirement of Glue & solder paste on same side of the PCB. Currently we are u
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Mon Sep 23 08:42:25 EDT 2002 | bdoyle
I have performed many insourcing vs. outsourcing analyses. The following are the key issues that are normally evaluated: Cycle time requirements for product development and manufacturing Cost of manufacturing (in-house vs. subcontracted) Inve
Electronics Forum | Thu Sep 12 18:37:09 EDT 2002 | tiusa
Hi Tony, as you might guess, a Nozzle Mfg. has stepped into this conversation. Having worked with many small, mid-size, and Fortune 500 companies for almost 15 years we have seen many "parts" pick up challenges. We were the first to offer "Complia
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