Electronics Forum: following (Page 176 of 253)

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW

Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p

Rephrase : mixed technology criteria.

Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong

Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are

Re: Mil-P-28809

Electronics Forum | Fri Oct 08 02:19:01 EDT 1999 | Brian

| Is anyone aware of a web page for military spec's? I am looking for Mil-P-28809. | | Thanks, | Mike Demos | MIL-P-28809 is definitely obsolete. Not only obsolete, it was possibly the most scientifically flawed standard ever to to be printed. I

More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: double sided step by step

Electronics Forum | Tue Oct 05 02:31:06 EDT 1999 | Eric

| | Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding

Re: Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX

| Hi, | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.

Re: Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 07:25:05 EDT 1999 | Wolfgang Busko

| | Hi, | | | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision cente

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Wed Sep 29 23:54:07 EDT 1999 | Dreamsniper

Hi everyone, Greetings! I�ve got a 2-layered through-hole PCB�s having the following problems: Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB Insufficient Solder and some solder never make it to t

Re: Gold Repair

Electronics Forum | Fri Oct 01 23:43:28 EDT 1999 | Jeff Ferry

| | Can someone help me find info on gold repair? I know it can be done, but I need to know how expensive it is, etc. | | | Paul: The following seel gold finger repair kits, in-case you haven't had your dose of heavy metals: | | Hunter Products 79


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