Electronics Forum | Thu May 21 20:06:12 EDT 1998 | Bill Schreiber
| Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently t
Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley
| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati
Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon
| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili
Electronics Forum | Mon Mar 02 21:54:10 EST 1998 | MONICA PARK
| Is there any publication or web-site where I can find out more information on the manufacturers of SMT and through hole equipment, the size of the market place, and the typical values of equipment? Dear. Sir. We are so pleased to contact with you
Electronics Forum | Mon Mar 02 21:57:35 EST 1998 | MONICA PARK
| | Is there any publication or web-site where I can find out more information on the manufacturers of SMT and through hole equipment, the size of the market place, and the typical values of equipment? | Dear. Sir. | We are so pleased to contact wit
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Mon Sep 17 17:09:32 EDT 2001 | jschake
Flux: No-clean pastes tend to have a wider print process window in terms of print speed and pressure. More importantly, no-clean pastes are more tolerant to changes in temperature and humidity. They also exhibit longer stencil life than water-solub
Electronics Forum | Fri Oct 19 01:33:30 EDT 2001 | ianchan
Hi, Encountered this deference to the vapour phase process that was supposedly "phased" out years ago? *pardon the pun* Any comments from folks who have used this proces before? how about folks who are currently using this process? even better, a
Electronics Forum | Tue Jan 22 20:32:08 EST 2002 | davef
Oooo, thanks for the conversion. Being metrically challenged, az a skratchin ma haid thar fer a mite. We do a G-10 160 thou and have similar issues. Now, we�ve talked about barrel fill [ie, slowing belt speed, increasing pre-heat temps, etc] befor
