Electronics Forum: following (Page 231 of 253)

Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 07:11:12 EDT 1999 | Earl Moon

Ladies and Gentlemen, As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous insigh

Re: Aperature opening for epoxy printing

Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW

| Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. | My regular stencil manufacturer recommend the following: | Thickness: 8 mils | 0805 opening: Oblong

Re: Parylene Coating of Plastic Parts

Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian

Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to

Re: Forum Sales

Electronics Forum | Mon Jul 26 19:18:07 EDT 1999 | Boca

| I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effectiv

Re: Forum Sales

Electronics Forum | Mon Jul 26 20:07:55 EDT 1999 | Rob Fischer

| | I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effect

Re: BGA fab: what's reasonable practise for double sided PCB?

Electronics Forum | Thu Jul 15 14:55:24 EDT 1999 | JohnW

| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa

Re: uBGA

Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee

| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

Re: Off Pad Printing

Electronics Forum | Mon Jun 28 22:02:13 EDT 1999 | Dave F

| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar

Papers Listed In Library Download Poorly

Electronics Forum | Thu Jun 24 22:22:06 EDT 1999 | Dave F

Problems with downloading papers from the library not withstanding, downloading other papers in the library is problematic, as follows: Understanding SP440 Heating & Vacuum Functions Credit/ Source: LEO HUERTA, TECHNICAL SERVICES ENGINEER Works fi


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