Electronics Forum | Thu Apr 18 17:29:00 EDT 2002 | dason_c
The industrial standard is follow the R.O.S.E test as a guideline per J-STD-001 and the limit is 10ug/sq. inch. Different tester with different equivalent factor with the ROSE and you can refer back to the manual, the Zero Ion tester with equivalent
Electronics Forum | Fri May 03 01:25:33 EDT 2002 | gerits
Dear Sir, I do not want to mix in this "subjective" discussion but as an employee of Assembl�on (buider of FCM II, FCM multiflex 50, 75, 100) I can provide you with MTTR, MTBF, placement data (0201), software, and other (also customer) data on our e
Electronics Forum | Fri Apr 19 15:48:28 EDT 2002 | davef
I don�t know much about zinc either. I can tell you that zinc forms no intermetallics with lead. So, I�m not so sure that �diffusion� is the correct term. Of the following: * Hwang "Modern Solder Technology For � * Wassink "Soldering In Electronic
Electronics Forum | Thu May 09 15:30:57 EDT 2002 | TomN
I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought w
Electronics Forum | Fri May 24 17:37:58 EDT 2002 | fastek
Seems like the landscape is changing in SMT equipment for US manufacturers. I have heard the following but I don't claim they are anything more than rumors: 1) Sanyo and Universal are parting ways and Sanyo will market their machines in the US direc
Electronics Forum | Tue May 28 17:33:31 EDT 2002 | wilcoxito
We are just getting started doing BGA assembly at our plant. Any helpful hints would be greatly appreciated. My first main question is about stencils. We are considering using diamond shaped holes for the BGA pads. Does anyone have any experience
Electronics Forum | Wed May 29 00:28:11 EDT 2002 | alex_kirichenko
Hi Ben! I was in your position just over 12 months ago.. We use round appetures for BGAs and don't have any problems with it, as long as thiknes of your stencil is correct. As for baking BGAs befor placing. I haven't had any problems with devices
Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Mon Jul 22 00:21:43 EDT 2002 | lysik
If a OEM does the wrong thing tell the World. Tell every single person you know. But also do the right thing by them when they do the right thing. Tell the World. If it's right it's right. UIC seems to be doing the right thing right now. Their regist
