Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
Electronics Forum | Tue May 28 16:19:52 EDT 2002 | zanolli
Hello Floyd, Yes, special tooling is required. The tooling usually consists of a press, push-in tooling and support plate tooling. The presses can range from relatively simple arbor type presses to automated hydraulic presses with sophisticated con
Electronics Forum | Mon Feb 24 20:51:52 EST 2003 | davef
Ryan, You are spot-on with your analysis of the 'flattened' glue deposits. How about this for a different approach[es] in explaining your method for removing caps from your board? * George Verboven has speculated here on SMTnet that the downward fo
Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas
I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to
Electronics Forum | Mon Aug 16 11:36:23 EDT 2004 | soease
Hi everybody, now that lead-free is coming, I'm looking forward to change the oven we own in company I work for. Eternal question: what's the best oven technology on market. I allready know that we won't work with IR ovens, but I would like to have
Electronics Forum | Thu Mar 24 19:17:43 EST 2005 | EA
Hi, We are running the automotive product and question was throw to us how do we ensure that our solder joint are good enough after reflow.....and during the sealant process, there's a bit of bend on the nozzle and it toughes the component and custo
Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP
James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R
Electronics Forum | Thu Nov 12 09:32:30 EST 2009 | spitkis2
Take a look at http://www.atco-us.com/products/info/3 . Benchtop version is also available. A full forced convection oven delivers much better thermal uniformity than an IR/forced air combo system. When comparing different ovens, some things to
