Electronics Forum: forces (Page 31 of 116)

PBGA Replacement

Electronics Forum | Mon Sep 22 16:00:43 EDT 2003 | Joe

Two BGA replacements (same location) and throw the card away is the rule we are following. Experience has taught us that anything beyond this and you'd be pushing it - specifically when your new PBGA's price is above $20.00. The biggest concern is

Heatsink Press

Electronics Forum | Tue Sep 23 18:48:57 EDT 2003 | ericsbrown

We have an application where we are applying a heatsink with a thermal tape that has pressure sensitive adhesive (psa) on either side. Does anyone know of an off-the-shelf heatsink press that we could use to apply a consistent, measured force for a

Cracked Tantalum Capacitors

Electronics Forum | Mon Mar 08 15:37:41 EST 2004 | pdeuel

What type of P&P machine? Useing any Placement force? Ramp speed in reflow? PCB thickness properly defined? Tooling supports too high? Any doubble stacking of parts? Occuring with only one part manufacturer? Start with processes where problem is note

Vacuum Nozzles

Electronics Forum | Thu Jun 10 20:20:30 EDT 2004 | M.L. Feather

Is there a way to have one nozzle on the HSP Chipshooter 4796 to use a higher force of vacuum than the other nozzles? For instance, an 8x4 embossed feeder has components that are wedged hard into the plastic and cannot be pulled out with regular vacu

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 12:23:17 EDT 2004 | soease

Thanx a lot for advice... My only question is: did you had troubles with prehaeating of the boards? I heard it was the only critical point due to chosen technology, infrared preheat (if it's still IR). I allready checked Vitronics Soltec and IBL,

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam

we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How

CP6 Nozzle sticking

Electronics Forum | Tue Mar 01 14:47:07 EST 2005 | Alex

I've just went thru cleaning all nozzles and I saw some of them stuck up. The reason for mine is that they're on the way out, between lock and the exit notch. I tried to reinstall them with the spring "forcing" the nozzle clockwise. Sound weird but I

Handskin reaction!!

Electronics Forum | Tue Feb 22 21:50:18 EST 2005 | KEN

Probably: 1. Laytex reaction 2. Some other exposure at work or home FWIW: Cleaning anything with alcohol sucks. Alcohol toxicity could be your problem, but not like you think (hand contact). Consider inhillation as the exposure point. Work sho

Solder joint strength

Electronics Forum | Mon Mar 28 14:57:46 EST 2005 | chon

So far I've been working with a xtal. I've been placing this on a board and the part was falling from the board. We found residues on leads and notified vendor as contamination, after that 100% of our production has been verified with a perpendicular

Solder joint strength

Electronics Forum | Tue Mar 29 09:02:13 EST 2005 | Indy

chon, we do a similar kind of perpendicular test, but have not found any kind of specifications to determine if the force is good eoungh. Since you mentioned that 6 pound-inch was enough for your application, could you provide some insight on how


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