Electronics Forum | Wed Jul 14 19:09:54 EDT 1999 | JohnW
| | | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stic
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Wed Jul 14 09:26:55 EDT 1999 | Dave F
| | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick.
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS
Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Fri May 27 14:15:21 EDT 2005 | ve7khz
Hi Folks, Starting a second SMT line this year and it's been (too) long since I have looked at newish machines and I am in need of some assistance with P&P machine selection. Here is what we currently have: Panasonic CM-202 chip shooter 216 8mm reel
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Wed Jan 23 23:45:35 EST 2019 | kiransahu
Piezoelectric type (office/industrial) In this method, a piezoelectric (piezo) element, whose volume is deformed when voltage is applied, is used to discharge ink particles. This element is attached to the component that is filled with ink. Then, th
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