Electronics Forum | Tue Mar 04 15:46:00 EST 2003 | EW
I'm not sure to what degree you are manually crunching this data.....If you can set up the data manually, or parse the data from a recording function, to allow it to import into a database with a formula for Cpk, and everything else you could ever in
Electronics Forum | Mon Jun 30 09:43:03 EDT 2003 | russ
Try searching the archives, I saw the formula posted in an earlier thread I belive that relating to Double sided with BGAs but I am not sure I think Dave F. posted this one. So what is an "R"QFP I haven't heard of that one before. Russ
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Mon Jun 07 17:07:42 EDT 2004 | russ
the only components I have had trouble with so far are PLCC68 and larger, Large Coils (2b and 3b size) Heavy crystals. Some BGAs if they are not PBGAs. There was a discussion on this and a formula was given to determine if a part will hang under th
Electronics Forum | Thu Jan 12 06:39:45 EST 2006 | Jeff
I'm a Production Supervisor in a food plant in California. I'm looking for the same training video I once saw. It is very short and sweet and right to the point and opens the eyes and minds of the workers. If you find it please tell me where you foun
Electronics Forum | Tue Dec 07 05:16:12 EST 2004 | kanwal324
We are using solder paste of Alpha Metals 390DH4. As per manufacturer guidelines the viscosity of paste after 1/2 hr. conditioning and after mixing in paste mixer,it shoule be between 800-1250KCP. Our customer is asking for viscosity to be maintained
Electronics Forum | Fri Mar 04 10:04:14 EST 2005 | jbrower
We use Alpha UP-78 (Older paste formula) and it works well for what we do. We standardized our stencils at 5mil with a 10% reduction on IC apetures and a home plate design on passive components. Additionally we use laser cut electro-polished stenci
Electronics Forum | Thu Apr 07 10:58:01 EDT 2005 | Dhanish
Need help from the experts on 1)simple way to measure the PCB warpage 2)what is the maximum warpage can the SMT machine allow the to accept and place the component without problem. 3)I have seen some people are using 7mils/inch as a Warpage spec. a
Electronics Forum | Tue Aug 23 07:59:53 EDT 2005 | avalancher
That's an interesting fact Ken. Now I think i've seen every figure out there. Let's see, CPH, DPMO, CPK, and now, hmm, what would this be called, PPPSF (parts placed per square foot). Does anyone have a formula on this to figure out my PPPSF?
Electronics Forum | Thu Aug 25 20:00:31 EDT 2005 | Dave
Try Heller Industrie's website at http://www.hellerindustries.com They have a formula that they offer for free that calculates land pad geometry to component weight to prevent drop off of components during second reflow. If you can't find it, give t
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