Electronics Forum | Thu Aug 09 15:56:50 EDT 2001 | davef
Thank you. IPC-2222 applies to rigid organic boards. It does not apply to ceramic boards. Since there is no 2222 analog for ceramic boards, I used 2222.
Electronics Forum | Wed Aug 15 16:06:55 EDT 2001 | davef
Coo What do you mean ehen you say "kept our BGA's under the magic 150 deg mark"?
Electronics Forum | Tue Aug 14 17:55:01 EDT 2001 | Boysen
Are you using a water soluble paste? Older generations of water soluble paste are notorious for voiding. Some of the new generation water soluble fluxes allow a much wider process window.
Electronics Forum | Tue Aug 14 21:29:29 EDT 2001 | mugen
Hi, Just to clarify the terms, traditional : aka : Ramp-Soak-Spike (RSS) profiling method tent : aka : Ramp-To-Spike (RTS) profiling method By search engines (eg. Yahoo), you can find more example profiles for your ref.
Electronics Forum | Thu Jun 13 01:35:09 EDT 2002 | bayanbaru
I am attach to Quality Dept. I want to know what are the important parameters to check before buying-off the reflow for production use.
Electronics Forum | Wed Aug 15 20:41:50 EDT 2001 | davef
It would be nice if someone had the answer, but often situations like this are peculiar. What not build models of each and then wring them out?
Electronics Forum | Tue Aug 14 15:44:04 EDT 2001 | davef
Check the fine SMTnet Archives for contacts at ASI and Conductive Circuits. They print materials on substrates to incorporate ECO, not sure about making the trace cuts, though.
Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef
BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl
Electronics Forum | Tue Aug 14 16:25:49 EDT 2001 | Hussman
I thought Dan saw the delamination after wash - not baking? What temp are your dryers on the washer set at?
Electronics Forum | Tue Aug 14 20:47:29 EDT 2001 | Pete
Hi, would like to get good info on the above solder paste metal content regarding their advantage and disadvantage against each other and their effect on fine pitch solderability. regards,
