Electronics Forum | Mon Jul 23 16:17:19 EDT 2007 | mleber
We have not had the best of luck with wet film. I agree on your statement. Depending on the mix and amount of solvent your results will vary. We were looking for something easy, accurate and foolproof.
Electronics Forum | Tue Jul 24 13:41:41 EDT 2007 | jdumont
We just measure the coupon before and after. We are always btw .002" - .003" acrylic. No auditor will say a word if you are doing this much control. Unless its NASA I suppose..... we've never had a problem with any of the avionics guys doing this tho
Electronics Forum | Mon Jul 23 16:01:24 EDT 2007 | Vinnie
Hi Does anyone know the Tech hotline for OZO Automation Inc. We have a Router Machine Model # 18 HS Serial numbers # 0052. Need to contact helpline for parts. Please help. Thanks
Electronics Forum | Mon Jul 23 16:56:04 EDT 2007 | mgrimes
Wasn't OZO bought out by JOT/Elektrobit? See link: www.elektrobit.com/file.php?72 Not sure if they provide support but worth a try.
Electronics Forum | Mon Jul 23 18:55:09 EDT 2007 | rons
OZO was bought out by JOT but a few of the employees started the above buisness for support and sales. Have used them and the past and they were very helpful, ask for Dwayne.
Electronics Forum | Tue Jul 24 07:57:55 EDT 2007 | davef
It sounds like the QFN component is not solderable. * Use ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * Contact your QFN component supplier for help * Consider a more active flux, since you might
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
Electronics Forum | Wed Jul 25 15:21:05 EDT 2007 | pjc
I have been following this story in I-Connect (pcb007) newswires, see the "Related Articles" below the current article for more on "It": http://www.pcb007.com/anm/templates/article.aspx?articleid=17420&zoneid=80&v=
Electronics Forum | Wed Jul 25 18:44:32 EDT 2007 | jmelson
Oh, boy! What a bunch of babble! "I've seen the future of the whole industry, but due to pending patent applications, I can't tell you anything about it except that it solves ALL problems, removes all barriers, enables infinite growth....." Yeah,
