Electronics Forum | Wed Apr 22 18:07:11 EDT 2009 | jgorajia
I would encourage everyone to get pricing and details from both Valor and Aegis, and get their module requirements. You never know.....times are tough and the buyer is in the driver's seat these days.
Electronics Forum | Tue Jan 13 11:25:42 EST 2009 | wbrenner
Is there a general guideline for component purchasing of extra parts over required amount due to SMT process loss, ped, damaged etc.?
Electronics Forum | Wed Jan 14 16:52:40 EST 2009 | vleasher
We currently use Epibond 7275 and it cures way too quickly to allow the component to settle down on the board. Have you used the Loctite 3609 in the application i'm speaking of with success?
Electronics Forum | Wed Jan 14 21:42:35 EST 2009 | davef
We view both Epibond 7275 and Loctite 3609 to be very similar. They're competing chip bonders.
Electronics Forum | Thu Jan 15 21:16:18 EST 2009 | davef
Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis
Electronics Forum | Fri Jan 16 06:53:33 EST 2009 | stevewilde
I am using Humiseal 1B31 conformal coating and xylene mix on a PVA coating machine. Bubbles are appearing between the pins of LCCs mainly and bubbling is worse when put through the IR oven. Does anyone have any suggestions or tips to elliminate this
Electronics Forum | Fri Jan 16 10:54:21 EST 2009 | realchunks
Hi Steve, Make sure your spray head is all the way down. If so, try slowing your rate of speed over the part. Which head are you using to coat this part?
Electronics Forum | Mon Jan 19 09:10:17 EST 2009 | stevewilde
Thank you for all of the advice. I am using the extended spray for these cards. Humiseal have recommended using their own thinners 600 instead, so will run some trials with this and also the humiseal pre-mixed material (at the moment we mix our ow
Electronics Forum | Tue Feb 03 11:42:54 EST 2009 | lmartenson
We use PVA and I have had bubbles that came from the pressure in the pressure pot being to high. Also the material filter was slightly clogged. I'm not sure of your setup hope this helps.
Electronics Forum | Tue Feb 03 13:47:59 EST 2009 | grics
I would also suggest looking at your ramp rate in the cure oven. We noticed that accelerated heating increased the "gas out" of the solvent. We run 1A33 and and do not exceed a .5/degC ramp rate.
