Electronics Forum | Mon Mar 06 16:42:25 EST 2000 | Jon Wentz
Hi PR, FYI,some adhesives harden within the stencil apertures with IPA if not cleaned well. We used Heraeus PD955PY and had to closely inspect our cleaning process of the stencil. Just another tip, ask your adhesive vendor for their recommendation o
Electronics Forum | Fri Mar 03 10:45:10 EST 2000 | PAI
We are dealing with a unique machine that is having a couple of problems that we are trying to fix. A component code error appears whenever editing is done to any part of the program, array, or component library. This error we believe is causing t
Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik
I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a
Electronics Forum | Sun Mar 05 13:02:00 EST 2000 | dave
We used this type of paste in a fine pitch application for over two years with no problems. You must be very careful of any (dust)or spillage while mixing for obvious reasons. In my opion the very thing that makes it interesting "freshness" is also i
Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann
To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h
Electronics Forum | Thu Mar 02 14:33:26 EST 2000 | Doug Philbrick
I have a customer wanting to hide the identity of a particular component on a PCB assembly. The product cannot be potted and since the PCB is the product he doesn't want to pour over that one chip for aesthetics reasons. Any ideas on ways to permanen
Electronics Forum | Fri Mar 03 14:01:49 EST 2000 | dean
This technique is commonly known as "black boxing". The majority of IC's are marked with ink. Simply use a tiny piece of sandpaper to "scratch the surface" and render the device blank. This will work with Laser marked parts as well. If your volum
Electronics Forum | Thu Mar 02 09:13:07 EST 2000 | jacqueline Coia
Could anyone please tell me if there is a quick simple formula for working out the ideal SMD footprint for a 52 pin QFP using the dimensions specified on the manunfacturers component drawing. I know of the IPC 'SMD land patterns' standard, which I e
Electronics Forum | Thu Mar 02 11:57:25 EST 2000 | Wolfgang Busko
Did you try the online-calculator at the IPC-page. If you have the datasheet it should be no problem. For wave soldering I can�t tell if it�s suitable for that particular part, but you should add extra pads at the end of each column to solderbridging
Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia
I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen
.gif)
