Electronics Forum | Wed Jun 20 18:21:33 EDT 2001 | davep
What experience does anyone have with a MS level 6 SMT component? I have a part that must go from component baking to reflow within six hours. According to the component mfg, a sealed MS bag w/ desicant is not sufficient protection to increase the
Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c
DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after
Electronics Forum | Thu Jun 21 20:46:53 EDT 2001 | davef
I doubt it. [Although, I can't say that I understand this as well as I'd like.] Francois Monette has a good handle on the topic. He has demonstated superior knowledge in this area with postings on the following threads on SMTnet: * Date: January
Electronics Forum | Thu Jun 21 07:57:09 EDT 2001 | brownsj
One of the systems I saw which was very good for a low cost inspection system was the Ersascope. http://www.ersa.com. This sytems looks underneath the BGA from the side so it will detect bridges though it probably isn't very good for insufficients. I
Electronics Forum | Thu Jun 21 10:36:37 EDT 2001 | traviss
A couple years ago Glenbrook would rent a small machine by the hour, you turn it on the ticker starts to count turn it off stops count you pay for that time. And they would apply a portion, or maybe it was all I don�t remember, of that rental towards
Electronics Forum | Fri Jun 22 12:15:36 EDT 2001 | StepBeyond John Myers
For fresh jobs in SMT world, including sales, see StepBeyond.com. I have been recruiting in SMT since 1992 (Myers & Associates) Recently we relaunched StepBeyond. It was Myers & Associates' own job board. Now we have state of the art technology (like
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
Electronics Forum | Sat Jun 23 21:04:44 EDT 2001 | Stefan
If you want to tinker a bit with old machines, you could buy an inexpensive ( under $ 10,000 ) used Pick&Place machine and reverse the polarity on the tape feeding motor. If you don't heat seal the cover tape, but use pressure sensitive cover tape,
Electronics Forum | Sun Jun 24 05:03:20 EDT 2001 | ronih
Hello, I need some information about footprint of BGA / fine BGA. As far as I know the pad on PCB should be the same as the pad on the BGA (much smaller than the ball dia.). I need some information regarding the hole SMT process: - Paste printing:
Electronics Forum | Mon Jun 25 17:01:18 EDT 2001 | traviss
Do you by chance have a copper layer soaking the heat away from the pads? If you do or even if you don�t you may want to try bumping your bottom heaters up, try bringing the heat through the PCB. This may help pull the solder down to the pads. This m
