Electronics Forum | Thu Sep 23 09:10:53 EDT 1999 | Wolfgang Busko
| I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. | | I Hope than you send my information about this. | | Try this Link http://mot-sps.com/soluti
Electronics Forum | Thu Sep 23 10:03:09 EDT 1999 | Wolfgang Busko
| | I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. | | | | I Hope than you send my information about this. | | | | | Try this Link http://mot-sp
Electronics Forum | Thu Sep 23 08:59:20 EDT 1999 | Wolfgang Busko
| Hiya, | | Could anyone please suggest recommended manufacturers of | IR rework stations for the removal of various SMT comps. | | Cheers | Why IR ? Ok, I�ve seen only one but that thing burnt the PCB before the solder was melting and costs a lo
Electronics Forum | Thu Sep 23 14:41:48 EDT 1999 | Doug Philbrick
| Hiya, | | Could anyone please suggest recommended manufacturers of | IR rework stations for the removal of various SMT comps. | | Cheers | I have 2 customers who went from hot air system to a PDR and they love it. The system will give them a ni
Electronics Forum | Wed Sep 22 13:49:47 EDT 1999 | Claude Couture
The machine is a Universal 6796 DIP inserter. The driver card for the X axis burned a couple of resistors and a trace, probably a couple of power transistors too. I had a spare card and put it in. Now on powering-up the machine, the X-Y table move
Electronics Forum | Wed Sep 22 10:55:37 EDT 1999 | Craig J.
I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb) a
Electronics Forum | Tue Sep 21 19:09:54 EDT 1999 | Jason Tomlinson
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Mon Sep 27 18:06:26 EDT 1999 | Scott Cook
| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard
Electronics Forum | Tue Sep 21 10:02:13 EDT 1999 | Wolfgang Busko
| I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | Thank you. | Just for ESD reasons
Electronics Forum | Tue Sep 21 08:43:28 EDT 1999 | Christopher Cross
We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the boar
