Electronics Forum | Wed Jun 26 01:08:09 EDT 2002 | ianchan
Hi Dave F, I'd hold you to that "could" opinion of yours... and I'd be most willing to give the new VP ovens a try if such ovens become commerically acceptable to the pocket and match up to our current process control requirements (that we can achie
Electronics Forum | Tue Jun 25 01:01:15 EDT 2002 | ianchan
Hi mates, has anyone ever done a DoE on the degree of warp PCB, after a SMT Reflow process? what were the findings and conclusion based on such a DoE? which were the critical (DoE) factors that influence the degree of warp PCB? any optimal reflow se
Electronics Forum | Tue Jun 25 09:31:45 EDT 2002 | Myfloh
Hi everybody, Does someone have experience in the assesment of Surface Mount devices? For the moment we have the Must System II of Multicore but it is not effective to assess the solderability of Surface mount devices. Indeed the conditions are not
Electronics Forum | Tue Jun 25 09:29:50 EDT 2002 | CPI
I�m looking for some type of fastener to secure identification tags to boards. The method would be inserting through a tooling hole on the brd .25� npt. We had been using nylon fasteners much like those used in the garment industry. However I am look
Electronics Forum | Wed Jun 26 09:01:47 EDT 2002 | davef
Can�t see where �poly� would be any more �ESD friendly� than nylon. Explain that please. Consider: * Attaching tags with metal wire that has no insulation. * Contacting a factory sales rep that specializes in ESD protection and carries a large numb
Electronics Forum | Wed Jul 03 14:34:45 EDT 2002 | razorsek
Jeff, what I generally use as a rule of thumb on multi-row connectors was a strip on the trailing side of the connector as it flows through the wave. The strip was always the same width as the diameter of your through-hole. The distance of the stri
Electronics Forum | Wed Jun 26 11:44:06 EDT 2002 | jseagle
Steve, We do not currently run BGAs, but I have been told by a CM we use that does BGAs, that our Heller 1500 (5 zone) oven has an insufficient number of zones to properly reflow a BGA. Anyone else have an opinion about this it would be appreciated
Electronics Forum | Wed Jun 26 12:18:40 EDT 2002 | dason_c
Steve, I suggest to review some of the paste handlering procedure from some of the supplier. Aim look have a better procedure for our industrial but you need to check with your paste requriement. ie. Indium can store the paste @25C for 3 mths??? h
Electronics Forum | Wed Jun 26 13:30:41 EDT 2002 | Steve L
Thanks, guys. The solder paste we are using is a kind of prototype from Alpha Metal - more aggressive, long floor life, etc. The paste I used to solder PBGA was out of fridge for about 3 weeks. It was still good for our other Non-BGA products. Be
Electronics Forum | Wed Jun 26 21:31:42 EDT 2002 | ianchan
Hi mate, suggestion: consider "re-fridge" the paste after each Lot (small volume) batch run, instead of leaving it at ambient temperature for 3mths. follow FIFO control of such re-fridged paste. check with your supplier (in documented format reply)
