Electronics Forum: forum (Page 5046 of 7889)

Profiling for Pb-free HASL

Electronics Forum | Thu Jun 06 14:59:47 EDT 2019 | cristian_amlima

Awhile back I faced a few problems because of that. To solve the problem, my only concern was about the peak temperature to assure that the alloy got melted. Peak temperature between 230°C and 235°C can assure that and usually is inside the sodler pa

Profiling for Pb-free HASL

Electronics Forum | Thu Jun 06 15:18:56 EDT 2019 | gregoryyork

Honestly, If I ever have an SMT problem it's when a profile is at 230-235C. We encourage minimum 240C and typically 245-250C. Many components call for 260C. Some Paste manufacturers advocated 230C in the early years of Lead Free and it was a disaster

Profiling for Pb-free HASL

Electronics Forum | Fri Jun 07 09:39:06 EDT 2019 | cristian_amlima

I totally agree with you when whe talk about a lead-free process. In my early comment I thought we were talking about a tin-lead process with the pcb pb-free, when the solder paste limits should be respected. That is the motive the temperatures I sa

Inline printer experience

Electronics Forum | Mon May 13 08:31:48 EDT 2019 | robl

Do you have in line 3D Solder Paste Inspection machines? If not the 2D inspection on the SP710 is very slow & not a patch on Hawkeye from DEK. If print time is not an issue then it doesn't matter. I have had both types of machine, and personally pre

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz

You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629

if use tray cannot solve the problem, you can change from the design 1)Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.

how to control warpage on panelized pcb during reflow process

Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel

if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t

Evest LED Mounter

Electronics Forum | Tue May 14 05:35:16 EDT 2019 | spoiltforchoice

You'll be lucky if there is I would guess. I think two places tried and failed to sell them in the UK and it looks like Manncorp gave up in the US too? Presumably that means they primarily exist in asian markets where they have some niche application

PCB bent due to mechanical force

Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas

You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on

PCB bent due to mechanical force

Electronics Forum | Sat Jun 01 01:15:52 EDT 2019 | dhanish

Thanks Steve.The bent we are seeing is at the location without any component .It is a small and long pcb,one side fully loaded with component .Thebother side got no component. We can manually bend the pcb at the side without the component. All the la


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