Electronics Forum | Sat Nov 06 10:00:11 EST 1999 | Robert Oertner
If you are talking about reflowing surfacemount on the solder side of the assembly, that is accomplished by gluing the smt components to the bottom of the board. I recomend that you use a chip wave in conjuction with the normal wave to get the best r
Electronics Forum | Wed Nov 03 03:26:38 EST 1999 | Wes
We have Siemens S-20 machine whose other gantry occasionally missmounts all its components in Y-direction(approx. 1/2 mm ). Most of the missmounts happens when there is a lot of 0603 or 0805s (B-side glue boards). Gantry picks up the components OK bu
Electronics Forum | Wed Nov 03 22:14:03 EST 1999 | Dave F
Anthony: John's points are well taken. All SMT components float to some degree. Fly shit floats more than multi-lead. Well duh!!! I know of no formula. The most cogent discussion is in THE BOOK (Klein Wassink's "Soldering In Electronics), but i
Electronics Forum | Tue Nov 02 08:57:36 EST 1999 | Kevin DuCasse
This is our first time out processing material with a finished thickness less than the standard 0.062 FR-4 material. We have an assembly that uses GIL MC5 with a finished thickness of 0.035 and we are having difficulty at placment with the array "bo
Electronics Forum | Thu Nov 04 19:51:28 EST 1999 | John
Thanks folks. The current vendor is doing an alcohol wash, top and bottom, then performing an ionic test on 100 boards. I'm not to confident in the testing because the readings for a "clean" board are 25 ugm/sq in and a "dirty" board are 40 ugm/sq in
Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik
Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting
Electronics Forum | Tue Nov 02 11:44:54 EST 1999 | Wolfgang Busko
Hi Pat, is the soldering Ok when you solder them by hand ? We use some larger ferrite beads with no problems in reflow but I must say that we use a vapour phase and only max 5 parts/PCB. They do have a high thermal capacity and you use a lot of them,
Electronics Forum | Fri Oct 29 13:45:03 EDT 1999 | David Vulcano
We are placing several axial components that have STEEL leads. Have noticed that the steel components do not get good flow thru(we manufacture to IPC-A-610 Class II Standards which reqires 75% flow thru) We are using Seho Wave Machines with Nitroge
Electronics Forum | Mon Nov 01 15:47:21 EST 1999 | Jim Snipes
Dave thaanks for your quick reply. The flow through probelm exists on several component, Examples; small Tan electolic caps.,electrolic epoxy caps. and one specfic lad on a resistor network. I have veried conveyor speed and readjusted heat sett ings
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
