Electronics Forum: forum (Page 5336 of 7890)

Re: Automated Labeling -vs Direct Part Marking

Electronics Forum | Fri Oct 29 10:57:45 EDT 1999 | JohnJ

We considered direct marking already John. It's not very practical for us to do that. We need to put labels on components as well as boards. A laser or inkjet would cause us to have to change too many things in our processes. We'd still need to do la

Collumn Grid Array

Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen

I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-

Re: Collumn Grid Array

Electronics Forum | Fri Oct 22 09:44:42 EDT 1999 | John Bashe

The CCGA package is difficult to handle and automate in the assembly process. The leads can be fragile, and vision recognition of the package and leads is difficult. Special lighting and/or a special vision algorithm will probably be needed if you wa

Re: Popcorning BGA in wave-soldering

Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko

That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co

Re: Popcorning BGA in wave-soldering

Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech

We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the

Fingers on Wave Machines

Electronics Forum | Sun Oct 17 23:17:01 EDT 1999 | MJI

I'm interested in the various ways to assure that the fingers on a wave machine are not bent or crooked - beyond a monthly or quarterly maintenance regimen. In fact, how do you know all's well even right after maintenance? That is, making sure that

Re: Chart of SMT Component styles/packaging

Electronics Forum | Wed Oct 20 04:42:02 EDT 1999 | park kyung sam

we did this for pad design of pcb and can also use it off- line programming for mounter. we had checked out all the component we used in our factory. we sorted 600 kinds parts using part size(L,W,T) ,number of lead ,shape with over 6,000 parts. a

Re: message replys

Electronics Forum | Thu Oct 14 09:05:17 EDT 1999 | Brian

Nancy, Cliff, There are pros and cons. Some of the longer threads take an age and a day to download when the server is busy, if everything is intact since the birth of Adam. Personally, I prefer it as is because I'm damn lazy and hate scrolling down

Re: message replys

Electronics Forum | Thu Oct 14 09:26:41 EDT 1999 | Clifford Peaslee

Brian & Nancy, Yes, our goal is to have the option of displaying the whole thread in one page while still leaving the current option available. Displaying all of the messages in a thread really doesn't work well with the old messages because they c

Re: PCB warpage

Electronics Forum | Thu Oct 14 20:42:07 EDT 1999 | Jeff Ferry

Grace, As deifned in IPC 7721 Procedure 3.2 Bow and Twist Repair "Bow and twist after soldering shall not exceed 1.5% for through hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties d


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