Electronics Forum | Thu Aug 27 17:40:11 EDT 1998 | Earl Moon
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve Steve, Hello again. Hope you guys (Intel) aren't going to do that
Electronics Forum | Thu Aug 27 12:36:05 EDT 1998 | Stefan Witte
| We are having a lot of problems with the Line Computer Speed on our Siemens Siplace Line. This seems to be a common problem when many different jobs, partnumbers, and package forms are stored on the line computer. | Please let me know if you are h
Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson
Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan
Electronics Forum | Wed Aug 26 07:00:16 EDT 1998 | Wayne Bracy
| I am looking for advice on feeders for the MPAV Panasonic machine. We are about to encounter our first experience with Panasonic. We are unsure of which style feeders to buy for tube parts. Parts mix includes all sizes of D-paks, SOICs, PLCCs and
Electronics Forum | Wed Aug 26 13:41:45 EDT 1998 | Earl Moon
| Chalk one up for the good and the bad. Who's going to play the uuuugly? | | Earl Moon | | Earl | Justin told me you were the ugly! I for one read many of the things you write and learn.............thanks | | Wayne Wayne, Always much appreciated.
Electronics Forum | Wed Aug 26 17:30:29 EDT 1998 | Clifford Peaslee
| Wayne, | Always much appreciated. Ugly, fugly, schmugly. Hell, I'm a raving beauty compared to some of you folks. I often wonder how a class picture would turn out, if at all. Also, have you heard Justin is getting married again? | Moonman Earl: I
Electronics Forum | Thu Aug 27 11:08:30 EDT 1998 | Richard Scarcelli
| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is
Electronics Forum | Fri Aug 28 12:49:24 EDT 1998 | Earl Moon
| | | Would like to know the following information on processing micro bga's: | | 1) Fine mesh solder paste .vs. tacky flux --- which is best | | 2) Stencil thickness for solder screen | | 3) Aperature size for standard pitch balls | | 4) Which
Electronics Forum | Mon Aug 24 20:18:51 EDT 1998 | S. L. Vito
I am studing the possibility of a line with one Siemens SIPLACE 80 F and a PANASONIC machine (cam be a MSH-G3 or MVIIF (m) or MSHII (m)). I have several reasons to do this, but i would like to know more details about operating this kind of line. Can
Electronics Forum | Tue Aug 25 12:43:47 EDT 1998 | Lance Smalley
Panasonic Factory Automation now has (or soon will) software to balance with other companies' machines. I don't know how it works yet, but is an option Lance | I am studing the possibility of a line with one Siemens SIPLACE 80 F and a PANASONIC machi
