Electronics Forum | Thu Aug 09 23:11:23 EDT 2001 | davef
Cheery disposition??? Would a few ;-) ;-) ;-) help? [Oh and look who is talking, the one planning the Mickie D gig after the traces on the this board start vaporizing with the fuseable link schtik.] Are you sure you're getting flux all the way up
Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW
Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall
Electronics Forum | Fri Aug 10 04:19:05 EDT 2001 | wister
There are lots of voids at solder joint of chips,the thickness of multilayer pcb is 3.2mm,top side have lots of chip component and bottom side has several BGA and QFPs.For top side profile,the preheat time is about 100s,soak time is about 75s,time ov
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Mon Aug 13 05:17:16 EDT 2001 | nifhail
Normally the specs I monitored in our temperature profiles are Slope 1-2 Deg C/sec, preheat 60 - 120 Sec at 120 Deg C - 150 Deg C, peak 215+/- 10 Deg C, above 183 Deg C is 45 - 75 Sec, total reflow is 3 - 5 minutes. Why is it that we don't monitor
Electronics Forum | Mon Aug 13 18:21:54 EDT 2001 | delnosa
Trying to find out if there are any data/articles/references out there that looks at the reliability of using SMC�s over interconnects(connectors). The dilemma is having a daughter card with a board-to-board connector vs. having the components (dis
Electronics Forum | Tue Aug 14 21:16:58 EDT 2001 | mugen
Dave, Do u talk with a whistle then? *grinz* Anyway, thanks for the detour down memory lane, it reminds me of my childhood, A friend and I, stuck a lawn mower motor unit, to my bike, to determine how fast a bike config, could run? It worked alrigh
Electronics Forum | Tue Aug 14 12:18:02 EDT 2001 | nifhail
I experienced assembled boards delaminated after washed. You know...those old datecode PCBs that I was talking about a few weeks back ? I was forced to use it, and of course prior using it I've baked them. I've baked them at 125 Deg for 4 hours and/
Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian
We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level
Electronics Forum | Thu Aug 16 13:46:06 EDT 2001 | Hussman
Hi Pavel, I'll bet you're talking after reflow - so in a nutshell - it is too much solder. Paste goes under the R or C and rests on the mask after placement. During reflow, this excess paste balls up along your part (wow, look Ma, no rocket scienc
