Electronics Forum: forum (Page 5701 of 7890)

Hot Air Rework Issue on Nearby Components

Electronics Forum | Wed Mar 30 15:29:37 EST 2005 | Mark

I am not an expert however, I don't see any issues with this. Those joints of nearby components will melt and solidify back once they go below 183 C. Don't see how this could present quality issues as components may pass through reflow several time

platinum clad nickel soldering

Electronics Forum | Thu Mar 31 17:27:36 EST 2005 | russ

Are we possibly talking palladium instead of platinum? I haven't yet heard of platinum terminations (seems expensive) If it is palladium over nickel, I can tell you that you need to reach 225-230 Deg. C in reflow and the TAL should be about 90 sec.

Solder Joint Strength

Electronics Forum | Thu Mar 31 19:41:36 EST 2005 | Dreamsniper

Can anyone guide me to what test do I need to be able to identify the strength of my fine pitch component solder joint? What value is available that I can use as a reference? Say 1.5 kg, 2.0 kg, 2.5 kg etc. I would like to have my fine pitch compone

Product Traveler

Electronics Forum | Wed Apr 13 15:32:37 EDT 2005 | mmjm_1099

Don't know if this helps at all but here you go. I take care of documentation, smt programming, and bill of materials and notes. We have a smaller company so this is how we handle alot of the issues at hand. Our product traveler consists of what w

CCGA

Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS

For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum

How to get away jointing problem

Electronics Forum | Sun Apr 03 03:48:05 EDT 2005 | iwan

I have a problem in my Lead Free smt production line,i run BGA product for the first time. The product consist BGA and Connectors. If i increase temperature in Reflow Oven it will be melting the Connector, but when i decrease the temp. BGA become raw

Outsourcing costs

Electronics Forum | Tue Apr 05 15:54:55 EDT 2005 | cmiller

Every company does things different. Some use machine time, some per placement, some per placement by part type. It would depend on how the company is set up and how they allocate overhead and what problems they do or dont have with particular part t

mask align on liquid solder mask

Electronics Forum | Mon Apr 04 22:40:07 EDT 2005 | davef

We'd contact suppliers of LPISM. Top LPISM available in the United States are: * Coates ImageCure XV501T & XV501TSM * Coates ImageFlex (Flexible Solder Mask) SV 601T * Enthone DSR 3241 and DSR 3241 GM * Rogers RFlex 8080 LP1 & RFlex 8080 LP3 (Flexib

Tooltronics II In-Line wash Manuel.........

Electronics Forum | Mon Apr 04 22:25:44 EDT 2005 | mrduckmann2000

Help, Does anyone have a copy or know where we may purchase a copy of a manuel for an old Speedline Tooltronics II in-line wash. Speedline doesn't even claim to have ever purchased the tooltronics line...lol. We have a machine that we keep bandaidi

GSM 1 Pushdown function.

Electronics Forum | Tue Apr 05 08:16:30 EDT 2005 | jax

This is not a built in function, you have to trick the machine. 1. Determine what you want to use to play "whack-a-mole" Regular or Modified nozzle. Regular will most likely get damaged from multiple "whacks" 2. Teach the nozzle


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Software for SMT placement & AOI - Free Download.
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