Electronics Forum | Mon Jan 29 11:19:09 EST 2007 | SWAG
That's what I'm talking about. Might need to calibrate, then. We usually rent a cal. kit and do the cal. ourselves. Just make sure you specify your block, head configuration, etc. when renting. As for frequency, we generally don't worry about it
Electronics Forum | Wed Jan 31 19:16:46 EST 2007 | mika
BTW GEB; When you put the feeder in the front bank did you pick the comps with Head #2 and from the feeder bank just opposite from the rear non working feeder bank? Did you make your feeder banks fixed or is it already that? It just hits me, if you
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Mon Jan 29 10:41:30 EST 2007 | aj
Rob, We have ran LF BGA's with Lead Paste in the past. We actually got a MicroSection Analysis carried out and a full report which approved the Process. We had peak Temp around 225oC- 230oC . Its a matter of running the Lead Process at its max and
Electronics Forum | Mon Jan 29 15:49:08 EST 2007 | rmitchell
Hi, Our Fuji CP65 nozzles are jamming in the up position. Mostly on caps and resistors, the .7mm (0402) and 1.0mm (0805) and 1.3mm (1206) sizes. They seem to be catching internally where the little peg slides down the slot. If you twist them they
Electronics Forum | Tue Jan 30 10:43:18 EST 2007 | darburch
Before you do anything to the windmills check the heights in your PD's and if you are using board supports be certain that they are set correctly. The CP 65 has approx 1.8mm of travel before the pin will get stuck, as the nozzle should only deflect .
Electronics Forum | Tue Jan 30 08:21:02 EST 2007 | GS
Please who can help me? I am looking for fiducial (cross shape) mark (target mark? Swiss mark?..)specifications used when COB wire bonding on PCB laminate. Pad pitch should be 250umm may be 220umm?). Mainly need to know which are the tolerances
Electronics Forum | Tue Jan 30 20:47:32 EST 2007 | davef
Inspection criteria [B Willis] Solder-paste application * Fine-pitch printing Satisfactory solder-paste should: ** Be aligned with all pads ** Conform to the stencil's pad-aperture size ** Have a smooth, flat void-free surface Acceptable solder paste
Electronics Forum | Thu Feb 01 02:36:40 EST 2007 | bvdb
Hi pr, The problem was happening on all three of the nozzles that we were using, about half the time the Z axis would rise up and go for the next nozzle and the other half it would stop almost as soon as it released the nozzle. When I inch the Z ax
Electronics Forum | Fri Feb 02 10:24:50 EST 2007 | FredC
Daxman, Have you eliminated nozzle variation? The difference between a new and used CP6 nozzle can be .15mm. On a CP4 I would think it could be more. On new Cp4 nozzles the difference in effective nozzle length should not be more than .04mm. You can
