Electronics Forum | Tue Sep 15 06:16:35 EDT 2009 | geb
Hi, We're using solder paste opposed to solder wire for hand soldering certain components. We are also using high temperature soldering irons with 450deg C tips as we are soldering onto aluminium (IMS) PCBs. The quantity of tips which we go through
Electronics Forum | Thu Sep 17 04:48:51 EDT 2009 | grahamcooper22
The colour you see on the pads is tin/copper intermetallic layer. In your reflow the immersion tin coating and the copper pad underneath react to form in intermetalic layer. The effect is worse the hotter the pcb or area of the pcb gets. In IR reflow
Electronics Forum | Fri Sep 18 09:18:06 EDT 2009 | ysutariya
Also, it wouldn't hurt to perform SERA testing to determine the amount of free tin to begin with. From what I remember, I think you need 30 microinches of free tin to ensure success. XRF won't give you an accurate thickness reading as it counts the
Electronics Forum | Thu Sep 24 13:42:46 EDT 2009 | larob57
Why do you even write, you can't even help anyway. Your just full of hot air YOU MAKE ME LAUGH BECAUSE YOU ARE PROVING ME RIGHT!!!HA-HA-HA SO instead of you running your suck say some thing that has to do with the removal of a GPU ON XBOX360! OH n
Electronics Forum | Thu Sep 17 11:19:57 EDT 2009 | jdumont
Does anyone have a reference to a spec for this? We have a tall SMT IC that we coat with AR coating in a Asymtek spray coating machine. We do not have the angle head option to spray from a 45 so the sides of tall parts are sometimes left uncovered.
Electronics Forum | Thu Sep 17 12:22:43 EDT 2009 | babe7362000
I was hoping someone could help me on this issue. We currently have this customer that needs their board extemely clean. We have tried many cleaning solutions at no end. We used an ionic cleaner still did not work. Their test is very tight and I w
Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg
Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf
Electronics Forum | Mon Sep 21 00:11:14 EDT 2009 | darrenj
We have a TP9 with a centering motor issue. (TPSYS Ver 2.5.3) The error message F-MOT-SETDYN C/3 Upper endpoint outside limits is shown during C-motor initiation. I've looked in the service program and also the parameters in TPSYS but can find no m
Electronics Forum | Mon Sep 21 15:45:35 EDT 2009 | boardhouse
Hi Ryan, Standard shelf life for FR4 Non-RoHs & Rohs material with HASL or Lead Free HASL would be 12 months + in a controlled environment. on all RoHs materials over 6 months, we would suggest your board shop run a solder ability test before ship
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
