Electronics Forum: forum (Page 6411 of 7890)

Re: solder balls on high temp.solder

Electronics Forum | Tue Dec 12 03:15:13 EST 2000 | Chris May

The profile that you should be using, hopefully, is detailed in the paste data sheet. Connect your thermocouples to various parts of the board, depending on layout, population etc; and then run some trials observing the profile on your oven monitor/

Re: solder balls on high temp.solder

Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph

I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste

Re: solder balls on high temp.solder

Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME

Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha

Re: career change

Electronics Forum | Tue Dec 12 15:22:50 EST 2000 | Michael Parker

Dave - the most significant difference between the two titles (that I have experienced) is the location of assignment. Usually MFG. Eng.'s are responsible to a fixed set of equipment and are more concerned with how the product acts within the machine

Re: career change

Electronics Forum | Wed Dec 13 08:56:49 EST 2000 | CAL

One other piece would be to map of the hot spots in the US market. California, NE, SE, Chicago and Texas are hot spots for Electronics manufacuring. Target companies in these areas and hit them with resumes. Some areas are starved for manufacturing e

tombstoning after wave?

Electronics Forum | Fri Dec 08 11:08:03 EST 2000 | Antonio

Ok fellas, tell me how you'd fix this! I'm having melf connectors that are tombstoning in the wave, NOT the reflow, the wave. I've never seen this before. All other parameters are the same...solder, preheats, placements, the board, building humidi

Re: tombstoning after wave?

Electronics Forum | Mon Dec 11 03:46:14 EST 2000 | JohnW

I have to say I've never heard of anything tombstoning over wave, I've seen issues where the glue dot is too high or off to one side creating a poorly seated component that has too big a gap between pad and endcap(and hence an open), but never a tomb

Re: tombstoning after wave?

Electronics Forum | Tue Dec 12 08:53:40 EST 2000 | Wolfgang Busko

I�m with ya both. I�m wondering why the hell those buggers didn�t just drop and started a new career mingling with the dross in the pot. If only a few for statistical reason and to confuse us all just showed this strange behavior and the majority de

Re: IPC Standards and ISO 9000

Electronics Forum | Wed Dec 06 20:19:24 EST 2000 | Michael Parker

Ralph- Good thing you found this website so early on in your CM worklife. I am guessing you knew the job was dangerous when you took it. Be sure to refer back here daily, you will learn a mountain of things in a short time. The library also has a va

Glue Witness Pattern Verifiable by FUJI???

Electronics Forum | Tue Dec 05 13:34:51 EST 2000 | NickMata

Hello all, at the present I have some product onto which I glue backside components. I dispense a pattern of "witness" to use as a visual cue as to the quality of the dispensed glue dots. A problem which I have encountered is that operators will oft


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